| D | AMPING LINKS |
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Overview:
DTI Damping Links are designed in a very application-specific manner based on the operating temperature range of the structure as well as the specific structural dynamics of interest. Often, a finite element model of the structure is utilized in the design in conjunction with the Modal Strain Energy Analysis approach. The DTI Damping Link concept can be extremely effective for attenuation of resonance behavior in cases where a viscoelastic material "link" may be located at an appropriate location on the structure such that relative motion occurs between one attachment point and the other attachment point for modal
displacements of
interest. The relative motion across the Damping Link results in strain in the
viscoelastic material of the Damping Link. The viscoelastic material
converts this mechanical strain into heat and dissipates the energy.
Vibration attenuation can be very significant in these cases.
DESIGN METHODOLOGY
The Modal Strain Energy Analysis approach, in conjunction with a finite element model of the structure, is typically utilized to determine the optimum stiffness of the Damping Link. Having determined the optimum stiffness of the Damping Link, the physical geometry of the Damping Link can be designed based on the dynamic mechanical properties of the appropriate viscoelastic material. The viscoelastic material is chose largely for appropriate modulus and loss factor properties at the temperature and frequency of interest.
APPLICATIONS
DTI Damping Links can be extremely effective for attenuation of resonance response of a given structure. The key is identification of a Damping Link location (or locations) in which modal displacements of the structure can be made to induce strains in a viscoelastic material located there. Production applications exist in the aerospace industry, automotive industry, scientific instrument industry, computer industry, etc.
EXAMPLE
The
following example of a DTI Damping Link was designed for a large
scientific instrument to attenuate a resonance (rocking mode) of the
instrument support structure occuring at approximately 8 Hz. This
resonance had degraded the performance and efficiency of the scientific
instrument. In this case, DTI Damping Links were located between the
support structure and ground. Cyclic rocking motion of the structure
induces strains in the viscoelastic elements of the Damping Link. The
Damping Link resulted in a factor of 10.0 reduction in response of the
support structure.
DTI Damping Links are designed in a very application-specific manner based on the operating temperature range of the structure as well as the specific structural dynamics of interest. Often, a finite element model of the structure is utilized in the design in conjunction with the Modal Strain Energy Analysis approach. The DTI Damping Link concept can be extremely effective for attenuation of resonance behavior in cases where a viscoelastic material "link" may be located at an appropriate location on the structure such that relative motion occurs between one attachment point and the other attachment point for modal
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| Damping Link on Stringer/Frame intersection on aircraft fuselage skin. |
DESIGN METHODOLOGY
The Modal Strain Energy Analysis approach, in conjunction with a finite element model of the structure, is typically utilized to determine the optimum stiffness of the Damping Link. Having determined the optimum stiffness of the Damping Link, the physical geometry of the Damping Link can be designed based on the dynamic mechanical properties of the appropriate viscoelastic material. The viscoelastic material is chose largely for appropriate modulus and loss factor properties at the temperature and frequency of interest.
APPLICATIONS
DTI Damping Links can be extremely effective for attenuation of resonance response of a given structure. The key is identification of a Damping Link location (or locations) in which modal displacements of the structure can be made to induce strains in a viscoelastic material located there. Production applications exist in the aerospace industry, automotive industry, scientific instrument industry, computer industry, etc.
EXAMPLE